Multi-chip module with power system

ABSTRACT

Embodiments include apparatus, methods, and systems having a multi-chip module with a power system. An exemplary electronic module includes a printed circuit board (PCB) having a memory and plural processors. A power system couples to and is disposed vertically above the PCB. A thermal dissipation device is disposed between the power system and the PCB for dissipating heat, via a direct heat exchange, from both the power system and the plural processors.

BACKGROUND

Some electronic systems utilize several printed circuit boards with manydifferent electronic components interconnected to the circuit boards. Asthese electronic systems decrease in size and increase in performance,packing density, heat dissipation, and power distribution architecturebecome increasingly important.

As noted, packing density is one important criterion in many electronicsystems. One way to reduce the actual size of an electronic device is tomore closely position the electrical components together. Electricalcomponents within a circuit board, however, are generally alreadytightly confined, and additional space may not be readily available. If,however, electrical components can be positioned to reduce the overallsize of the electronic device, then significant savings and advantagescan be realized.

Heat dissipation is also an important criterion in many electronicsystems. Circuit boards may include a plurality of heat-generatingdevices that must be cooled in order to operate within a specifiedoperating temperature. If these heat-generating devices are notsufficiently cooled, then the devices can exhibit a decrease inperformance or even permanently fail.

As processor and memory technologies advance, power distributionarchitecture concurrently must evolve to meet demands of processors andmemories. Designers consider many factors when developing powerdistribution architectures for electronic systems. For instance,important considerations include positioning power in close proximity toprocessor circuit boards, providing reliable power to the processorcircuit boards, and dissipating heat from the power converter and/orpower supplies.

The design and layout of printed circuit board components can be quitecomplex and challenging. Designers must consider many important factors,such as packing density, heat dissipation, and power distributionarchitecture. Improvements in these areas can realize important benefitsfor electronic systems and devices.

SUMMARY

Embodiments in accordance with the present invention include apparatus,methods, and systems having a multi-chip module with a power system. Anexemplary electronic module includes a printed circuit board (PCB)having a memory and plural processors. A power system couples to and isdisposed vertically above the PCB. A thermal dissipation device isdisposed between the power system and the PCB for dissipating heat, viaa direct heat exchange, from both the power system and the pluralprocessors.

In another exemplary embodiment, a method comprises connecting a memoryand plural separate processors to a circuit board; connecting, to form avertically stacked configuration, a power system board to the circuitboard; providing a thermal dissipation device between the power systemboard and the circuit board; dissipating heat from a surface area of thepower system board with a first surface of the thermal dissipationdevice; and dissipating heat from a surface area of the pluralprocessors with a second surface of the thermal dissipation device.

Other embodiments and variations of these embodiments are shown andtaught in the accompanying drawings and detailed description.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is an exploded side view of a block diagram of an electronicassembly in accordance with an exemplary embodiment of the presentinvention.

FIG. 2 is a side view of the electronic assembly of FIG. 1 with theelectronic assembly being assembled together.

FIG. 3 is an end view of FIG. 2.

FIG. 4 is a top view of FIG. 2.

FIG. 5 is a top view of the FIG. 2 with the power system removed fromthe electronic assembly.

FIG. 6 is a top view of FIG. 2 with the power system and thermaldissipation device removed from the electronic assembly.

FIG. 7 is a side view of an exemplary embodiment of an electronicassembly.

FIG. 8 is an end view of FIG. 7.

FIG. 9A is an exploded perspective view of a power system between twothermal dissipation devices.

FIG. 9B is an exploded perspective view of another embodiment of a powersystem between two thermal dissipation devices.

FIG. 10 is an exploded side view of an exemplary embodiment of anelectronic assembly.

FIG. 11 is a side view of the electronic assembly of FIG. 10 with theelectronic assembly being assembled together.

FIG. 12A shows an exemplary embodiment of a processor/power module.

FIG. 12B shows another exemplary embodiment of a processor/power module.

FIG. 12C shows yet another exemplary embodiment of a processor/powermodule.

DETAILED DESCRIPTION

FIGS. 1-6 show an electronic system or assembly 100 in accordance withan exemplary embodiment of the present invention. The electronicassembly 100 includes two printed circuit boards (PCB) or printed wiringboards (PWB) 102 and 104. The PCBs 102 and 104 can have a variety ofconfigurations and still be within embodiments in accordance with theinvention. By way of example, the PCBs can include power module circuitboards, voltage regulation module (VRM) circuit boards, controllerboards (such as a special type of expansion board that contains acontroller for a peripheral device), expansion boards (such as any boardthat plugs into an expansion slot of a computer), or modules. As anotherexample, the PCB 102 can be a motherboard, and the PCB 104 can be adaughterboard.

A motherboard is a printed circuit board that can be used in a personalcomputer, server, or other electronic device. The motherboard (alsoknown as a main board or system board) can provide attachment points forprocessors, graphics cards, sound cards, controllers, memory, ICs,modules, PCBs, and many other electronic components and devices in acomputing system. The daughterboard can be utilized as an extension ofthe motherboard or other card or board. The daughterboard can haveplugs, sockets, pins, connectors, or other attachments for themotherboard or other boards. Connectors 106A and 106B, for example, canbe used to electrically couple the PCB 102 to the PCB 104. Connectors106 provide a mechanical and electrical interface or connection betweenthe PCBs and may include, for example, a removably connectable plug(male) and socket (female). Alternatively, a single connector can beused to connect the PCBs 102 and 104. Further, a connection mechanismbetween PCBs 102 and 104 can be located at various positions, such as,but not limited to, the sides and/or ends of the PCBs.

The PCBs 102 and 104 include a plurality of electronic components ordevices. For example, the PCB 104 includes a plurality ofheat-generating components or devices 110. These heat-generating devicesinclude any electronic component that generates heat during operation.For example, heat-generating devices include, but are not limited to,electronic power circuits, integrated circuits (ICs) or chips, digitalmemory chips, application specific integrated circuits (ASICs),processors (such as a central processing unit (CPU) or digital signalprocessor (DSP)), discrete electronic devices (such as field effecttransistors (FETs)), other types of transistors, or devices that requireheat to be thermally dissipated from the device for the device tooperate properly or within a specified temperature range. An ASIC cancomprise an integrated circuit or chip that has functionality customizedfor a particular purpose or application. The PCBs 102 and 104 can alsoinclude a plurality of electronic components or device that may or maynot generate heat, that may generate low or insignificant amounts ofheat, or that may generate heat but not require the generated heat to bethermally dissipated from the device for the device to operate properlyor within a specified temperature range. Examples of such devicesinclude, but are not limited to, resistors, capacitors, transistors,diodes, memories, etc.

The electronic assembly 100 includes at least one thermal solution orthermal dissipation device 120. Thermal dissipation devices include, butare not limited to, heat spreaders, cold plates or thermal-stiffenerplates, refrigeration (evaporative cooling) plates, heat pipes,mechanical gap fillers (such as a plurality of rods, pins, etc.),thermal pads, or other devices adapted to dissipate heat. Further,thermal dissipation devices include thermal compounds and thermalinterface material that can be used to form a thermally conductive layeron a substrate, between electronic components, or within a finishedcomponent. For example, thermally conductive resins, tapes, moldedthermoplastic compounds, adhesives and greases can be used between aheat-generating device and thermal dissipating device to improve heatdissipation and/or heat transfer. Further, thermal dissipation devicesinclude heatsinks. A heatsink is a component designed to reduce thetemperature of a heat-generating device or component, such asheat-generating components 110. A heatsink, for example, can dissipateheat in a direct or indirect heat exchange with the electroniccomponents, the heat being dissipated into surrounding air orsurrounding environment. Numerous types of heatsinks can be utilizedwith embodiments in accordance with the present invention. For example,embodiments can include heatsinks without a fan (passive heatsinks) orheatsinks with a fan (active heatsink). Other examples of heatsinksinclude extruded heatsinks, folded fin heatsinks, cold-forged heatsinks,bonded/fabricated heatsinks, and skived fin heatsinks. Further, thethermal dissipation device, including heatsinks, can use liquids orphase change material.

The electronic assembly 100 also includes at least one power supply orpower system 130. Electrical connectors or power coupling devices 140connect the respective power system 130 to the PCB 104. FIGS. 5 and 6show four connectors 140 located in respective corners of the PCB 104and/or power system 130. Although four connectors 140 are shown,embodiments in accordance with the invention are not limited to aparticular number or location of connectors. For example, a singleconnector can be used to couple the power system 130 to the PCB 104.Alternatively, the connectors can be located at various positions, suchas, but not limited to, the sides and/or ends of the PCB 104 and/orpower system 130.

The power system 130 can include numerous embodiments for providingpower to electronic components (such as heat-generating components 110)and/or PCBs (such as the PCB 104) within the electronic assembly 100.For example, the power system can be a factorized power architecture(FPA) module, a power converter, such as a direct current (DC) converteror DC-DC converter, DC linear regulator, AC-DC converter, DC switchingregulator, or DC charge pump.

The power system 130 can be configured as PCBs, power module assemblies,power circuit cards/boards, and/or power module PCBs. As best shown inFIG. 2, the power system 130 is disposed in a parallel and verticallystacked-up relationship with the thermal dissipation device 120 and PCBs102 and 104.

The power system 130 may be modular and replaceable. In someembodiments, the power system 130 is an independently-operable unit ormodule that can be constructed with standardized units or dimensions forflexibility and replaceability for use in the electronic assembly 100.Further, the power system 130 can be connected to or removed from theelectronic assembly (example, the PCB 104) without connecting, removing,or replacing other components in the electronic assembly 100 (example,the heat-generating components 110). By way of illustration, suppose forexample that power system 130 fails or otherwise needs replaced orupgraded. The power system 130 can be disconnected and removed from thePCB 104 without removing or replacing the thermal dissipation device120, the heat-generating components 110, and/or the PCBs 102 and 104.

Once connected, the PCB 102 is generally parallel to the PCB 104. ThePCBs 102 and 104 are mechanically and electrically connected to form avertical stacked-up configuration. In particular, the connectors 106Aand 106B couple the PCBs together.

As best shown in FIGS. 2 and 3, the electronic assembly 100 comprisesthree different vertically stacked layers. A first layer includes thePCB102; a second layer includes the PCB 104; and a third layer includesthe power system 130. Thermal dissipation device 120 is disposed orsandwiched between the second and third layers such that a distancebetween the second and third layer is approximately equal to a thicknessof the thermal dissipation device. In one exemplary embodiment, thethermal dissipation device 120 substantially fills a volume of spacethat is created between the power system 130 and heat-generatingcomponents 110 of PCB 104. As shown for example in FIGS. 1-6, a top side152 of the thermal dissipation device 120 extends along all of orsubstantially all of the surface area (length x width) of an underside154 of the power system 130. Likewise, a bottom side 156 of the thermaldissipation device 120 extends along all of or substantially all of thesurface area (length x width) of the top sides of the heat-generatingcomponents 110 and/or PCB 104.

The thermal dissipation device 120 can directly or indirectly attach orcontact various layers and/or electrical components (such as the powersystem 130, the heat-generating components 110, and/or PCB 104). Forexample, the thermal dissipation device 120 can directly contact thepower system 130 so as to directly transfer or dissipate heat away fromthe power system. Further, the thermal dissipation device 120 candirectly contact the heat-generating components 110 so as to directlytransfer or dissipate heat away from the heat-generating components.

The thermal dissipation device 120A can utilize a remote heat exchanger(RHE). An RHE enables the thermal dissipation device to be remote fromthe heat-generating device (such as PCB 104, heat-generating components110, and/or power system 130). For example, heat can be transferred fromthe heat-generating device to an attachment block having a heat pipe.The heat pipe, for instance, can be a hollow copper pipe containing afluid and wicking material. Through a process of vaporization andre-condensation, heat travels through the heat pipe to a heat exchanger,such as a finned heat sink. Localized airflow can be used to evacuatethe heat to the environment.

As shown in FIG. 1, thermal dissipation device 120 comprises a unitaryor single member. Embodiments in accordance with the invention, though,can utilize a wide variety of types and number of thermal dissipationdevices. For example, the thermal dissipation device 120 can comprise aplurality of individual, separate members.

The thermal dissipation device 120 can be an active device that producesan airflow. For purposes of illustration only, the electronic assembly100 is shown with an airflow direction as indicated with arrows in FIGS.2 and 3 (the airflow being into the page and indicated with a circle and“X” in FIG. 2). The airflow can be provided, for example, with a fan orother device positioned within the electronic assembly 100 or within orproximate the thermal dissipation device 120. The airflow is directed ina pathway that is parallel to the PCBs 102 and 104 and power systems130. A primary airflow can thus be directed at, above, or below the PCB104, the heat-generating components 110, the power system 130, and/orthe thermal dissipation device 120. Further, the primary airflow can besimultaneously directed to several different components/layers (such asthe PCB 104, the heat-generating components 110, the power system 130,and/or the thermal dissipation device 120) or exclusively at individualcomponents/layers. Thus, the same airflow can be used to cool ordissipate heat simultaneously from multiple layers and/or components orsolely from a single layer and/or component. Further, the airflow can beutilized to assist or augment heat dissipation. For example, the thermaldissipation device can directly contact one or both of the power system130 and/or heat-generating components 110 and effect direct dissipatingheat exchange. The airflow can simultaneously be directed to one or bothof the power system 130 and/or heat-generating components 110 to furthercool these devices and assist in heat dissipation.

As shown in FIGS. 2-6, a single thermal dissipation device 120 can beused to dissipate heat from several different heat-generating devices110. For example, thermal dissipation device 120 is sandwiched betweenpower systems 130 and PCB 104. In this configuration, the same thermaldissipation device 120 simultaneously dissipates heat away from both thepower system 130 and the heat-generating devices 110.

Various different electronic components, layers, and PCBs can becombined into different embodiments in accordance with the invention.FIGS. 7 and 8 illustrate one such exemplary embodiment as electronicassembly 700. In this figure, a system board 702 connects to a processorcircuit board 704 with a processor connector 706A and a system connector706B. The processor circuit board 704 can include (among otherelectrical components) processors, memories, and ASICs. For example, theprocessor circuit board 704 can have numerous electronic heat-generatingcomponents, such as two processors 712A and 712B, an ASIC 714, andmemory 716, to name a few examples. A thermal solution 720 is positioneddirectly above the processor circuit board 704 to cool and dissipateheat, via direct heat exchange, from the processors 712A, 712B, ASIC714, and memory 716. A power circuit board 730 is above the thermalsolution 720. The thermal solution 720 can cool and dissipate heat, viadirect heat exchange, for the power circuit board 730. Electricalconnectors 740 couple or connect the power circuit board 730 to theprocessor circuit board 704. The power circuit board 730 can includepower controls that can, for example, provide power controlfunctionality for the power circuit board.

Embodiments in accordance with the present invention can utilize amodular connective architecture. If a particular electronic component(including PCBs) or device fails or otherwise needs to be replaced, theelectronic component can be removed from the module or the electronicassembly and replaced with a new and/or different component. As such,the electronic assemblies can be constructed with standardizedelectronic components and/or dimensions to enable flexibility andvariety of use and exchange of components. Looking to FIG. 7 as anexample, if the power circuit board 730 fails or needs to be replaced,the power circuit board 730 can be disconnected or uncoupled from thepower connectors 740 and removed from the electronic assembly 700 whilethe processor circuit board 704 and system board 702 remain mechanicallyconnected. A new and/or different power circuit board can thereafter beconnected to the connectors 740 and utilized with the electronicassembly 700. As such, expensive heat-generating components 110 (such asprocessors, memories, ASICs, etc.) can remain unchanged and do not needto be removed or replaced.

As used herein, the term “module” means a unit, package, or functionalassembly of electronic components for use with other electronicassemblies or electronic components. A module may be anindependently-operable unit that is part of a total or larger electronicstructure or device. Further, the module may be independentlyconnectable and independently removable from the total or largerelectronic structure.

The configuration or arrangement of electronic components, layers,and/or modules shown in the figures saves weight, space, and costs sincethe components and/or layers are efficiently spaced and additionalthermal dissipation devices are not required. For example, embodimentsin accordance with the present invention can utilize a variety ofmodules. Looking to FIGS. 2 and 3, the PCB 104 can be a processor modulethat includes heat-generating components 110 (such as two separateprocessors, an ASIC, and memory all on the same board or card). Asanother example, the power system 130 can form a power system module.The power system module can vertically stack and connect or coupled, viaconnectors 140, to the PCB 104. The thermal dissipation device 120 canbe disposed or sandwiched between the power system module and processormodule. Together, the power system module, connectors, processor module,and thermal dissipation device form a power/processor module that can beremovably connected to, for example, the PCB 102. FIGS. 2 and 3, forexample, show such a processor/power 160 module connected, viaconnectors 106A and 106B, to PCB 102.

The processor/power module 160 has a general rectangular configuration.A top surface 162 is formed from the top surface of the power system130, and a bottom surface 164 is formed from the bottom surface of thePCB 104. The connectors 140 can form ends 166A, 166B, respectively.Embodiments in accordance with the present invention may utilizeprocessor/power modules with various shapes and sizes and various numberof processors. By way of example only, the processor/power module 160with two processors can be configured to have overall dimensions of 194mm length (X-axis) by 71 mm width (Y-axis) by 22 mm height (Z-axis).

In order to facilitate modularity within the electronic assembly,various removable connections between electronic components can beutilized. By way of example, such connections include, but are notlimited to, land grid arrays (LGAs), pin grid arrays (PGAs), plugs(example, male), sockets (example, female), pins, connectors, soldering,or other removable or disconnectable attachments.

Embodiments in accordance with the invention are not limited to a singlepower system 130 vertically stacked on a single PCB 104. For example,more than two power systems can be vertically stacked on the PCB 104.Alternatively, more than one PCB 104 having plural vertically stackedpower systems can be mechanically and electrically coupled to a singlePCB 102.

Heat can be conducted or exchanged through plural layers and/or pluralmodules. This heat can be evacuated or dissipated from a common exitlocation or common surface area. For example, heat generated by theheat-generating components can be vertically conducted or transferredthrough the power system and heat dissipation device and thereafterdissipated into the air or environment at a top surface of theelectronic assembly. FIGS. 9-11 show an exemplary embodiment forconducting and dissipating heat in accordance with embodiments of theinvention.

As shown in FIGS. 9-11, a PCB 102 connects to a PCB 104 via connectors106A and 106B. The PCB 104 includes a plurality of heat-generatingcomponents 110. A first thermal dissipation device 120A is positioned atan outer surface of the electronic assembly or on top of power system130. A second thermal dissipation device 120B is sandwiched orpositioned between PCB 104 and power system 130.

FIGS. 9A and 9B show exemplary embodiments for the power system andthermal dissipation device. The power system 130 includes at least oneopening or hole 932. Each hole 932 is adapted or shaped to receive aportion of the thermal dissipation device such that the portion extendsthrough the hole.

In FIG. 9A, the thermal dissipation device 120A includes at least oneextension or protrusion 934 that extends outwardly from a body of thethermal dissipation device. The extension 934 is adapted and shaped tofit through a corresponding hole 932 and contact a top outer surface 936of thermal dissipation device 120B.

In FIG. 9B, the thermal dissipation device 120B includes at least oneextension or protrusion 934A that extends outwardly from a top surface940 of a body of the thermal dissipation device and at least oneextension or protrusion 934B that extends outwardly from a bottomsurface 942 of the body of the thermal dissipation device. The extension934A is adapted and shaped to fit through a corresponding hole 932 andcontact a bottom outer surface 950 of thermal dissipation device 120A.The extension 934B is adapted and shaped to abut or contact a topsurface of heat-generating components 110.

By way of illustration, the embodiment shown in FIG. 9A is illustratedin the electronic assembly 100 of FIGS. 10 and 11. Here, thermaldissipation device 120A includes three extensions 934 that extenddownwardly from a bottom surface of the thermal dissipation device 120A.The power system 130 has a body with three holes 932. The threeextensions 934 extend through the three holes 932 to contact or abut atop surface 936 of thermal dissipation device 120B.

The heat-generating components 110 generate heat. This heat is conductedor transferred from the top surfaces 944, through the thermaldissipation device 120B, through extensions 934, through thermaldissipation device 120A, and dissipated out through a top surface 980 ofthermal dissipation device 120A.

FIGS. 12A-12C show other exemplary embodiments in accordance with theinvention. These embodiments, for example, can be implemented withprocessor/power module 160 or other embodiments.

FIG. 12A shows a processor/power module 160 that includes a thermaldissipation device 220A having a plurality of openings 240A. Theopenings 240A can have a variety of configurations and/or shapes andinclude slots, holes, etc. Further, the openings 240A can be formed fromadjacent pins, rods, fins, etc. The openings 240A enable an airflow (theairflow being into the page and indicated with a circle and “X”) to passthrough the thermal dissipation device 220A. During operation of themodule 160, heat generated from the power system 130 transfers to a baseportion 222A of the thermal dissipation device 220A, while heatgenerated from the heat-generating components 110 transfers to a secondbase portion 224A of the thermal dissipation device 220A. Heat generatedfrom both the power system 130 and heat-generating components isdissipated as air passes through the openings 240A of the thermaldissipation device 220A.

FIG. 12B shows another example of a power/processor module 160. Here,the thermal dissipation device 220B is formed of two separate components260A and 260B. During operation of the module 160, heat generated fromthe power system 130 transfers to a base portion 222B of component 260A,while heat generated from the heat-generating components 110 transfersto a second base portion 224B of component 260B. Heat generated fromboth the power system 130 and heat-generating components is dissipatedas air passes through the openings 240B of the thermal dissipationdevice 220B.

FIG. 12C shows another example of a power/processor module 160. Here,the thermal dissipation device 220C is formed of a plurality of separatecomponents 270A, 270B, 270C, and 270D. Each component, for example, candissipate heat for one or more components (such as one or more ofheat-generating components 110, PCB 104, and/or power system 130).During operation of the module 160, heat generated from the power system130 transfers to a base portion 222C of component 270A, while heatgenerated from the heat-generating components 110 transfers to a secondbase portion 224C of components 270B, 270C, and 270D. Heat generatedfrom both the power system 130 and heat-generating components isdissipated as air passes through the openings 240C of the thermaldissipation device 220C.

Embodiments in accordance with the invention can be utilized in a widevariety of different methods and embodiments. For example, embodimentsin accordance with the present invention can utilize embodiments taughtin U.S. patent application Ser. No. 10/800,837 filed Mar. 15, 2004,entitled “Multi-Processor Module” and incorporated herein by reference.As another example, an exemplary method can comprise connecting pluralheat-generating components to a first circuit board. The heat-generatingcomponents can include plural separate processors (example processorsformed on separate dies), ASICs, memories, and other devices. A powersystem can be connected in a vertical stacked-up configuration to thefirst circuit board. One or more power connectors can couple the powersystem to the first circuit board. A thermal dissipation device isdisposed or sandwiched between the first circuit board and the powersystem. The thermal dissipation device thermally dissipates heat awayfrom both the first circuit board and the power system. The thermaldissipation device can simultaneously dissipate heat (for example via adirect heat exchange) from both the first circuit board and the powersystem. Additionally, the thermal dissipation device can comprise,utilize, or generate a flow of air in an airflow pathway. The airflowpathway can be directed to any one of or any combination of the firstcircuit board, the power system, the thermal dissipation device, and/orthe heat-generating components coupled or attached to a top surface ofthe first circuit board. Together, the power system, first circuitboard, thermal dissipation device, and heat-generating components form apower/processor module. This module can be connected to a second circuitboard (such as a system board or motherboard) and arranged, for example,in a vertically stacked-up configuration. The power/processor module canbe removed from the second circuit board. Thereafter, the componentswith in the module (such as the thermal dissipation device, the PCB, theprocessors, the memory, the ASIC, and/or the power system) can beindividually or jointly repaired or replaced. The revisedpower/processor module can then be re-connected to the second circuitboard.

One skilled in the art will appreciate that a discussion of variousmethods should not be construed as steps that must proceed in aparticular order. Additional steps may be added, some steps removed, orthe order of the steps altered or otherwise changed.

While the invention has been disclosed with respect to a limited numberof embodiments, those skilled in the art will appreciate, upon readingthis disclosure, numerous modifications and variations. It is intendedthat the appended claims cover such modifications and variations andfall within the true spirit and scope of the invention.

1) An electronic module, comprising: a printed circuit board (PCB)having a memory and plural processors; a power system coupled to anddisposed vertically above the PCB; a thermal dissipation device disposedbetween the power system and the PCB for dissipating heat, via a directheat exchange, from both the power system and the plural processors. 2)The electronic module of claim 1 wherein the thermal dissipation devicefurther dissipates heat, via a direct heat exchange, from the memory. 3)The electronic module of claim 1 wherein the thermal dissipation devicedirectly contacts both the processors and the power system fordissipating heat directly from the processors and power system to thethermal dissipation device. 4) The electronic module of claim 1 whereinthe thermal dissipation device has a top surface with a surface areathat directly contacts a bottom surface of the power system. 5) Theelectronic module of claim 4 wherein the surface area of the top surfaceextends substantially along all of a surface area of the bottom surfaceof the power system. 6) The electronic module of claim 1 wherein thethermal dissipation device has a bottom surface with a surface area thatdirectly contacts a top surface of the processors. 7) The electronicmodule of claim 6 wherein the surface area of the bottom surface extendssubstantially along all of a surface area of the top surface of theprocessors. 8) The electronic module of claim 1 comprising two differentvertically stacked layers separated from each other, the layersincluding the PCB as a first layer and the power system as a secondlayer. 9) The electronic module of claim 1 wherein the thermaldissipation device substantially fills a volume of space formed betweena surface area of a top side of the PCB and a surface area of a bottomside of the power system. 10) A method, comprising: connecting a memoryand plural separate processors to a circuit board; connecting, to form avertically stacked configuration, a power system board to the circuitboard; providing a thermal dissipation device between the power systemboard and the circuit board; dissipating heat from a surface area of thepower system board with a first surface of the thermal dissipationdevice; and dissipating heat from a surface area of the pluralprocessors with a second surface of the thermal dissipation device. 11)The method of claim 10 further comprising conducting heat from thesurface of the plural processors through at least one opening in thepower system board to a second thermal dissipation device located abovethe power system board. 12) The method of claim 10 further comprising:dissipating heat from the plural processors with (i) a direct heatexchange from the plural processors to the thermal dissipation deviceand (ii) an airflow generated by the thermal dissipation device onto theplural processors. 13) The method of claim 10 further comprising:dissipating heat from the power system board with (i) a direct heatexchange from the power system board to the thermal dissipation deviceand (ii) an airflow generated by the thermal dissipation device onto thepower system board. 14) The method of claim 10 further comprising:connecting the power system board, the circuit board, and the thermaldissipation device together to form a rectangular shaped module;connecting the module to a system board; removing the module from thesystem board; replacing only the power system board; re-connecting themodule having the replaced power system board to the system board. 15)The method of claim 10 further comprising: providing, above the powersystem board, a second thermal dissipation device; conducting heat fromthe plural processors, through plural openings in the power systemboard, and through the second thermal dissipation device; dissipatingthe heat from a surface of the second thermal dissipation device. 16)The method of claim 10 further comprising: substantially filling avolume of space between the power system board and the circuit boardwith the thermal dissipation device; extending a portion of the thermaldissipation device through an opening in the power system board tocontact and transfer heat to a second thermal dissipation device. 17) Anelectronic module, comprising: a circuit board having plural separateprocessors; a power board coupled, to form a vertically stacked-upconfiguration, to the circuit board for providing power to the circuitboard, the power board having plural openings; and a thermal dissipationdevice disposed between the circuit board and power board, wherein thethermal dissipation device has a top surface portion extending throughthe plural openings of the power board and has a bottom surface portiondirectly above a top surface area of the processors. 18) The electronicmodule of claim 17 wherein the thermal dissipation device generates anairflow pathway onto the thermal dissipation device and the power board.19) The electronic module of claim 17 wherein the thermal dissipationdevice dissipates heat, via a direct heat exchange, from both the powerboard and processors and conducts the heat through the plural openings.20) The electronic module of claim 17 wherein: the electronic module hasa rectangular shape; the circuit board forms a bottom surface of themodule, the power board forms a top surface of the module, and the firstand second surfaces are parallel and spaced a distance approximatelyequal to a thickness of the thermal dissipation device.